EUV photomasks (2 nm generation and beyond)
In 2024 DNP succeeded in resolving the fine patterns needed for EUV photomasks for logic at the 2 nm generation and beyond, and began providing evaluation masks for High-NA.
Specifications
| Exposure method | EUV (including High-NA) |
|---|---|
| Generation | 2 nm and beyond (volume production planned for fiscal 2027) |
| Main applications | Advanced logic semiconductors |
Specifications as published by the maker. See the sources below.
Overview
DNP's EUV photomasks are the masters used to transfer circuit patterns to wafers by EUV lithography. In December 2024, DNP announced that it had succeeded in resolving the fine patterns needed for logic semiconductors at the 2 nm generation and beyond.
It resolved 17 nm line-and-space patterns and has completed basic evaluation of photomasks for High-NA EUV lithography. For the 2 nm generation, it aims to start volume supply in fiscal 2027.
Development also draws on collaboration with the Belgian research institute imec.
Key features
- Resolves the fine patterns needed for the 2 nm generation and beyond
- Basic evaluation of masks for High-NA EUV completed
- Target of volume supply in fiscal 2027
Applications
- Advanced logic at the 2 nm generation and beyond
- High-NA EUV lithography
More from Dai Nippon Printing (DNP)
- QFN lead frames · Lead frames
Sources
Last updated: October 23, 2026