Wafer weight, area and thickness calculator
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KEY POINTS
A 300 mm silicon wafer is 775 µm thick and weighs about 128 g; a 200 mm wafer is 725 µm thick and weighs about 53 g. Larger wafers are specified thicker to limit sag under their own weight. A 300 mm wafer has 2.25 times the area of a 200 mm wafer, so the same processing time yields more than twice as many chips, which is the economic reason for larger diameters.
Inputs
Volume lost to the notch or orientation flat and to edge bevels is ignored (less than 0.1% at 300 mm). A FOUP itself weighs about 4 kg, and a full 25-wafer 300 mm FOUP weighs about 8 kg.
Standard silicon wafer dimensions (SEMI nominal values)
| Size | Diameter | Thickness | Area | Weight | Area vs. 100 mm | Main uses |
|---|---|---|---|---|---|---|
| 2 inch | 50.8 mm | 279 µm | 20 cm² | 1.3 g | 0.06x | Compound semiconductors, research |
| 3 inch | 76.2 mm | 381 µm | 46 cm² | 4.0 g | 0.15x | Compound semiconductors, research |
| 100 mm (4 inch) | 100 mm | 525 µm | 79 cm² | 9.6 g | 0.25x | Compound semiconductors, MEMS |
| 125 mm (5 inch) | 125 mm | 625 µm | 123 cm² | 17.9 g | 0.39x | Older lines |
| 150 mm (6 inch) | 150 mm | 675 µm | 177 cm² | 27.8 g | 0.56x | Power, analog, SiC |
| 200 mm (8 inch) | 200 mm | 725 µm | 314 cm² | 53.0 g | 1.00x | Mature nodes, power, MEMS |
| 300 mm (12 inch) | 300 mm | 775 µm | 707 cm² | 127.6 g | 2.25x | Advanced logic and memory |
| 450 mm (18 inch) | 450 mm | 925 µm | 1590 cm² | 342.6 g | 5.06x | Standard only (volume production shelved) |
Why larger wafers are thicker
Wafer thickness is specified to increase with diameter. A large wafer that stayed thin would sag under its own weight, making breakage during handling and slip (crystal dislocations) during heat treatment more likely. The 775 µm thickness of 300 mm wafers was chosen as a balance between sag and material cost. Chips are eventually ground down to about 50 to 100 µm from the back, so most of the thickness is there for mechanical strength during manufacturing.
A 300 mm wafer has 2.25 times the area of a 200 mm wafer, so the same tool time yields more than twice as many chips, which is the economic case for larger wafers. The move to 450 mm was effectively frozen in the mid-2010s because the industry could not agree on who would pay for equipment development. SiC for power semiconductors is in the middle of moving from 150 mm to 200 mm.
FAQ
How thick is a 300 mm wafer?
The SEMI nominal thickness is 775 µm. A 200 mm wafer is 725 µm and a 150 mm wafer 675 µm. Wafers are thinned from the back to about 50 to 100 µm before packaging.
How much does a full FOUP weigh?
A FOUP itself weighs about 4 kg, and with 25 wafers of 300 mm it weighs about 8 kg.
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Last updated: October 23, 2026