Backgrinders
Backgrinders thin wafers from the back side with diamond grinding wheels after the front-side circuits are finished. Rough and fine grinding steps bring the wafer to its target thickness, which can be well under 100 µm for stacked memory and advanced packages.
What it does
Grinding leaves a damaged layer that weakens the die, so it is usually followed by stress relief such as dry polishing, CMP or etching. In DBG (dicing before grinding), the wafer is partly diced first and grinding separates the chips.
Products (9)
- DAG810 · DISCO
A simple, compact manual grinder with 1 spindle and 1 chuck table. Its footprint is 1.02 m².
- DFG8340 · DISCO
A fully automatic grinder for wafers of 200 mm and smaller that achieves stable, high flatness with a rigid spindle. It succeeds DFG830.
- DFG8360 · DISCO
A high-precision 300 mm grinder that reduces the lapping load in the planarization step of wafer manufacturing.
- DFG8540 · DISCO
A 200 mm grinder with 2 spindles and 3 chuck tables designed for thin finish grinding to 100 µm or less.
- DFG8560 · DISCO
A 300 mm grinder with 2 spindles and 3 chuck tables for thin finish grinding to 100 µm or less. It also supports DBG.
- DFG8830 · DISCO
A grinder with 4 spindles and 5 chuck tables for thinning hard, brittle materials such as sapphire and SiC. Footprint is 3.5 m².
- DGP8761 · DISCO
A fully automatic grinder/polisher for Φ200 and 300 mm wafers. It performs backgrinding through stress relief in one tool and can thin wafers to below 25 µm.
- DGP8762 · DISCO
The next-generation 300 mm grinder/polisher that integrates everything from backgrinding to stress relief.
- Ulucus™ G · Tokyo Electron (TEL)
TEL's wafer thinning system that combines grinding, scrub cleaning, spin wet etching and inspection in one tool.
Japanese makers in this category
- DISCO · 8 product(s) listed
- Tokyo Electron (TEL) · 1 product(s) listed
Other back-end equipment
- Analog test systems (3)
- Burn-in systems (3)
- Dicing saws (13)
- Electron microscopes for observation (SEM/TEM) (3)
- Final test equipment (4)
- Laser dicing equipment (9)
- Memory test systems (10)
- Organic analysis instruments (3)
- Surface analysis instruments (XPS/SIMS) (4)
- Test handlers (5)
- Thermal analysis instruments (TG-DTA/DSC) (3)
- TSV formation equipment (4)
Sources
Related calculators
Japanese equipment by category
Last updated: October 23, 2026