DAL7440
An 8-inch tool for the KABRA process, which continuously irradiates the ingot from the top with a laser to form a separation layer at a set depth and peels the wafer off from there.
Maker: DISCO · Official product page
Specifications
| Cutting method | Laser slicing (KABRA) |
|---|---|
| Supported ingots | 8-inch SiC, up to 40 mm thick |
| Related models | KABRA!zen (full automation) |
| Main applications | High-speed SiC wafer production and more wafers per ingot |
Specifications as published by the maker. See the sources below.
Overview
DAL7440 is DISCO's laser slicer using the KABRA process. It continuously irradiates the ingot with a laser to form a separation layer (KABRA layer) at a specified depth and peels the wafer off from that layer. KABRA stands for Key Amorphous-Black Repetitive Absorption.
Its target is SiC, a material expected to replace silicon in power devices. Compared with cutting by wire saw, it produces wafers with less surface waviness. No alignment is needed, and it has automatic orientation flat detection, ingot thickness measurement and wafer marking to track the number of wafers processed.
It handles Φ8-inch ingots, with larger diameters possible in the future. Maximum ingot thickness is 40 mm, and the tool measures 750 (W) × 1,350 (D) × 1,800 (H) mm. It was developed from the earlier DAL7420 for 6-inch ingots, and as of January 2018 DISCO had obtained or applied for 58 patents related to this technology.
Key features
- KABRA process (laser-formed separation layer, then peeling)
- Φ8-inch ingots, up to 40 mm thick
- Wafers with less surface waviness
- No alignment needed, automatic OF detection, ingot thickness measurement
Applications
- Slicing wafers from SiC ingots
Other wire saws and wafer slicing equipment
- MWS-SiC6 · Takatori
More from DISCO
Sources
Wafer manufacturing equipment: more products
Last updated: October 23, 2026