DDS2300
A die separator that cleanly separates thin wafers with DAF by cool expansion. It is also used for separation after stealth dicing.
Maker: DISCO · Official product page
Specifications
| Type | Cool expansion (tape expansion at low temperature) |
|---|---|
| Wafer size | Φ300 mm |
| Main applications | Separation after SDBG and SDTT, DAF cutting |
Specifications as published by the maker. See the sources below.
Overview
DDS2300 is a fully automatic die separator from DISCO. It cleanly separates thin wafers with DAF (die attach film).
In full-cut dicing, DAF burrs and pickup failures during die bonding are problems. Using DAF in the DBG process also requires a step that cuts only the DAF. DDS2300 reduces how deep the laser must cut into the DAF, lowering debris and also cutting the cost of consumables such as surface protective films.
It uses the fact that DAF becomes brittle at low temperature, separating the DAF stably by cool expansion, which expands the tape at low temperature. It also stably separates chips from wafers that have an internal modified layer formed by stealth dicing. Tape slack after expansion is removed by heat shrink, so the wafer can go to die bonding still on its tape frame.
Key features
- DAF separation by cool expansion
- Separation after stealth dicing
- Heat shrink removes tape slack
Applications
- Separation of thin wafers with DAF
- Chip separation after SDBG
Other laser dicing equipment
More from DISCO
Sources
Last updated: October 23, 2026