DAS8930
A semi-automatic 300 mm surface planer that flattens metal and resin with ultra-high precision using a diamond bit.
Maker: DISCO · Official product page
Specifications
| Type | Diamond bit surface planing (1 spindle, 1 chuck table) |
|---|---|
| Processing accuracy | TTV 3.0 µm or less, bump height variation 1.0 µm or less (5 mm square) |
| Surface roughness | Ra 0.02 µm or less |
Specifications as published by the maker. See the sources below.
Overview
DAS8930 is DISCO's semi-automatic surface planer for 300 mm workpieces.
Ultra-precise planarization with a diamond bit flattens ductile materials such as metals, resins and composites of them with high accuracy, solving problems of height variation in bumps and of surface roughness.
Processing accuracy is a TTV of 3.0 µm or less, bump height variation of 1.0 µm or less within a 5 mm square chip, and a cut surface roughness of Ra 0.02 µm or less. The lineup also includes the fully automatic DFS8960 and other models.
Key features
- Ultra-precise planarization with a diamond bit
- Bump height variation of 1.0 µm or less
- Surface roughness of Ra 0.02 µm or less
Applications
- Leveling bump heights
- Planarization of resin and metal composites
Other wafer-level packaging equipment
- FPA-5520iV · Canon
- FPA-8000iW · Canon
- DFS8960 · DISCO
More from DISCO
Sources
Wafer-level packaging equipment
Last updated: October 23, 2026