DAG810
A simple, compact manual grinder with 1 spindle and 1 chuck table. Its footprint is 1.02 m².
Maker: DISCO · Official product page
Specifications
| Type | 1 spindle, 1 chuck table (in-feed grinding) |
|---|---|
| Wafer size | Φ8 inch (Φ300 mm optional) |
| Dimensions | 600 × 1,700 × 1,780 mm |
Specifications as published by the maker. See the sources below.
Overview
DAG810 is a manual grinder from DISCO. It is a simple, compact grinder with 1 spindle and 1 chuck table that can grind workpieces up to Φ8 inch.
The tool is 600 mm wide, 1,700 mm deep and 1,780 mm high, with a footprint of only 1.02 m². A rigid, low-vibration spindle gives good grinding results, and it supports in-feed grinding and, as a special specification, creep-feed grinding.
It handles a wide range of materials besides silicon wafers and is also used for process evaluation of hard, brittle materials and for machining electronic components. Typical uses include grinding evaluation of silicon and compound semiconductors, resin grinding and Cu post reveal for CSP/WL-CSP, flatness improvement of LT/LN, and processing of green ceramics and sapphire.
Key features
- Footprint of 1.02 m²
- Rigid, low-vibration spindle
- In-feed and creep-feed grinding
Applications
- Grinding evaluation and small-lot processing
- Resin grinding and Cu post reveal for CSP
Other backgrinders
More from DISCO
Sources
Last updated: October 23, 2026