DAD3660
A dual-spindle dicing saw for large package substrates up to 360 mm square.
Maker: DISCO · Official product page
Specifications
| Type | Automatic, facing dual spindles |
|---|---|
| Maximum workpiece | 360 mm square |
| Effect | Up to 90% higher throughput than DAD3350 (300 mm special specification) |
Specifications as published by the maker. See the sources below.
Overview
DAD3660 is a dicing saw with dual spindles from DISCO. It handles large package substrates.
With a special dicing frame or jig table, it supports workpieces up to 360 mm square and can dice the increasingly large package substrates used for fan-out WLP and other packages. Several substrates can be processed while mounted on one tape frame, reducing workpiece exchange time and dicing tape use.
Dual cutting with two spindles at the same time raises throughput by up to 90% over the earlier tool. A sub chuck table allows blades to be dressed during processing, stabilizing quality on hard, brittle materials such as glass and on ductile materials such as resin and metal. A 2.2 kW spindle supports heavy-load processing.
Key features
- Up to 360 mm square
- Processes several substrates at once
- Up to 90% higher throughput
- Blade dressing during processing
Applications
- Large package substrates such as FOWLP
- Cutting glass and resin substrates
Other dicing saws
More from DISCO
Sources
Last updated: October 23, 2026