DDS2030
A die separator that uses roller scanning to separate wafers after stealth dicing at high throughput.
Maker: DISCO · Official product page
Specifications
| Type | Breaking by roller scanning |
|---|---|
| Supported | Φ300 / 200 mm tape frames |
| Key feature | Separates polygonal and curved chips; automates protective film lamination and removal |
Specifications as published by the maker. See the sources below.
Overview
DDS2030 is DISCO's die separator that greatly shortens breaking time. It separates wafers with an internal modified layer formed by stealth dicing at high throughput.
Unlike the conventional method of breaking line by line, it uses roller scanning. Even for very small chips that are hard to separate by tape expansion alone, it delivers high productivity and high-quality separation regardless of chip size.
It can also separate polygonal chips whose separation lines are not straight, as well as curved shapes. Mechanisms for laminating and removing surface protective film are built in, so lamination, breaking and removal are all completed inside the tool.
Key features
- Roller scanning
- Fast separation of very small chips
- Separation of polygonal and curved shapes
Applications
- Chip separation after stealth dicing
Other laser dicing equipment
More from DISCO
Sources
Last updated: October 23, 2026