PNX332B
A final polisher for 300 mm wafers. Its 3-table polishing stage processes 6 wafers at once from intermediate polishing to finishing.
Specifications
| Polishing method | Single-side final polishing (3 tables) |
|---|---|
| Wafer size | 300 mm |
| Main applications | Super-mirror finishing of silicon wafers |
Specifications as published by the maker. See the sources below.
Overview
PNX332B is Okamoto Machine Tool Works' fully automatic final polisher for 300 mm wafers. The maker describes it as a best seller among 300 mm final polishers.
Its polishing heads and transfer mechanism have special structures, with index transfer and a polishing stage of 3 tables. It polishes 6 wafers at once from intermediate to final polishing and transfers 4 wafers at once.
It achieves atomic-level super-mirror, ultra-high-gloss surfaces and is designed to improve edge profile and removal uniformity. It processes stably with high accuracy and high throughput and handles the final polishing step for silicon wafers. The series also includes PNX312.
Key features
- Fully automatic 300 mm final polisher
- 3 tables with index transfer, 6 wafers polished at once
- Atomic-level super-mirror finishing
- Better edge profile and removal uniformity
Applications
- Final polishing of silicon wafers
Sources
Wafer manufacturing equipment: more products
Last updated: October 23, 2026