Thermal shock test chambers

TSA series thermal shock chambers

A stationary-sample thermal shock chamber that switches between hot and cold with dampers without moving the samples. Power consumption is 35 to 50% lower than earlier models.

Maker: ESPEC · Official product page

Specifications


Test methodAir type (stationary samples, damper switching)
StandardsIEC 60068-2-14 Na, MIL-STD-883K
Related modelsHumidity thermal shock chamber / TSB series liquid thermal shock chamber
Main applicationsEvaluating resistance of electronic components and mounted boards to temperature cycling

Specifications as published by the maker. See the sources below.

Overview


The TSA series are ESPEC's thermal shock chambers. They expose samples alternately to high and low temperatures, using the stress of expansion and contraction from temperature changes to accelerate and evaluate failures such as cracks in solder joints and packages.

In this stationary type, the samples do not move, and dampers switch between low and high temperatures in the same chamber. Because the samples do not move, there is no vibration stress, giving more accurate test results. Temperature ranges are ambient +50 to +200 °C for high exposure and -65 to 0 °C for low exposure on the EL series, and +60 to +200 °C and -70 to 0 °C on the ES series.

Temperature recovery is fast and temperature distribution uniform. A Φ50 cable port for access to samples is standard, and a manual vertical sliding door saves space. A maintenance warning function for predictive maintenance, remote monitoring over LAN and multilingual display are also standard. It supports tests to IEC 60068-2-14 Na and MIL-STD-883L.

Key features


Applications


Other thermal shock test chambers


More from ESPEC


Sources


  1. ESPEC: TSA series product page

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Last updated: October 23, 2026