Burn-in systems

RBC series burn-in chambers

Burn-in chambers designed for good temperature distribution and allowable heat load with burn-in boards inserted. There are 4 models with different temperature ranges.

Maker: ESPEC · Official product page

Specifications


TypeBurn-in of packaged devices (with burn-in boards inserted)
Processing unitPer burn-in board
Temperature and powerRBC-H +70 to +150 °C / RBC-M +20 to / RBC-L −30 to / RBC-U −55 to +150 °C
Main applicationsScreening of semiconductor devices in general, including ICs and discretes

Specifications as published by the maker. See the sources below.

Overview


The RBC series are ESPEC's burn-in chambers. They are thermal chamber systems for static burn-in, used for reliability evaluation and high-volume screening of semiconductor devices. With burn-in boards inserted, they offer excellent temperature distribution and allowable heat load.

Temperature ranges by model are +70 to +150 °C for RBC-H, +20 to +150 °C for RBC-M, -30 to +150 °C for RBC-L and -55 to +150 °C for RBC-U. There are 6 sizes, types 0/2/4/8/10/12, with widths from 780 to 2,300 mm and a common height of 2,050 mm and depth of 1,530 mm.

Energy is saved with an HFC refrigerant with zero ozone depletion potential, opening control of ventilation dampers and electronic expansion valves that control refrigerant flow. Molded parts are marked with their material for easier recycling. They are used to evaluate ICs, discretes, semiconductor devices in general, electronic components, electronic units and boards.

Key features


Applications


Other burn-in systems


All burn-in systems and Japanese suppliers

More from ESPEC


Sources


  1. ESPEC: RBC series product page

More on this topic


Burn-in systems

Last updated: October 23, 2026