FineSAT 7
An ultrasonic imaging system that strengthens the functions of FineSAT Ⅲ. An in-house AD board improves image quality, and a 300 mm diameter wafer can be inspected in one pass by the transmission method.
Specifications
| Probe frequency | 5 to 400 MHz |
|---|---|
| Effective stroke (X × Y × Z) | 350 × 350 × 80 mm |
| Maximum scan speed | 1,200 mm/s (nominal) |
| Maximum measurement points | 400,000,000 as standard (2,000,000,000 with the GUI PC option) |
| Dimensions (W × H × D) | 1,590 × 1,360 × 950 mm |
Specifications as published by the maker. See the sources below.
Overview
FineSAT 7 is Hitachi Power Solutions' ultrasonic imaging system. It is the latest model, strengthening the functions of the earlier FineSAT Ⅲ, and improves the image quality of internal structures of increasingly fine, multilayer semiconductor devices and electronic components and of defects such as delamination, voids and cracks at bonds.
An in-house AD board with a built-in FPGA raises sampling resolution 16 times and the measurement cycle 2 times compared with the earlier model. An AD board of up to 8 Gsps for 400 MHz probes records waveforms continuously, and a technique that averages waveforms at 8 points around each pixel suppresses random noise.
The measurement tank has been enlarged without changing the tool's outer dimensions, so a 300 mm (12-inch) diameter wafer can be inspected through all layers at once by the transmission method. Previously each half had to be measured separately. It complies with SEMI safety standards as standard, and because ultrasonic output is 5 W or less, no installation notification is required.
Key features
- In-house AD board with 16 times the sampling resolution and 2 times the measurement cycle
- One-pass inspection of 300 mm diameter wafers by the transmission method
- Probe frequency of 5 to 400 MHz, maximum scan speed of 1,200 mm/s
- Complies with SEMI safety standards as standard
Applications
- Inspection of delamination, voids and cracks inside semiconductor packages
- Defect inspection of wafer bonds
Sources
Last updated: October 23, 2026