IC1000™ series
A polyurethane CMP pad with uniform fine foam. It is regarded as the industry standard for CMP pads.
Maker: Nitta DuPont · Official product page
Specifications
| Types | Polishing pad (foamed polyurethane) |
|---|---|
| Related products | Grooving (XY, concentric, radial), perforation |
| Main applications | Device CMP in general |
Specifications as published by the maker. See the sources below.
Overview
IC1000 is a polishing pad for CMP (chemical mechanical polishing) handled by Nitta DuPont and is positioned as the industry standard for CMP pads. A polishing pad is a consumable that polishes and flattens the wafer surface together with slurry.
Its formulation is consistent, with a quality control track record of continuous improvement over more than 20 years. It offers a high removal rate and planarization performance that removes steps.
It is used in many CMP steps, including bulk Cu polishing, polysilicon, tungsten, STI (shallow trench isolation), oxide and buff polishing.
Key features
- Industry-standard CMP polishing pad
- Consistent formulation and improvement for more than 20 years
- High removal rate and step removal
Applications
- CMP of Cu, W and polysilicon
- STI and oxide CMP, buff polishing
Other polishing pads and carrier parts
- GLANZOX · Fujimi Incorporated
- Suba™ series · Nitta DuPont
Sources
Polishing pads and carrier parts
Last updated: October 23, 2026