Nitta DuPont
A Japanese supplier of polishing pads for CMP and silicon wafer polishing, including the IC1000 and Suba series.
ニッタ・デュポン・Materials・Last updated: October 23, 2026
Overview
Nitta DuPont handles the IC1000 series of foamed polyurethane CMP pads, which it describes as the industry standard, with a consistent formulation improved over more than 20 years. They are used for Cu, tungsten, polysilicon, STI and oxide CMP.
It also supplies the Suba series, polyurethane-impregnated nonwoven pads developed for primary and secondary polishing of silicon wafers.
Business: CMP and wafer polishing pads
Why it matters
Pads are consumed continuously in CMP, so pad consistency directly affects planarization results.
Main products
- •CMP pads (IC1000 series)
- •Wafer polishing pads (Suba series)
Products (2)
- IC1000™ series · Polishing pads and carrier parts
- Suba™ series · Polishing pads and carrier parts