SEC-22C
A multi-function vacuum evaporation system with an electron beam source and a cryopump. Evaporated material reaches the wafer almost perpendicularly, making it suited to lift-off.
Maker: Showa Shinku · Official product page
Specifications
| Evaporation source | Electron beam (controlled by a quartz crystal thickness monitor) |
|---|---|
| Supported substrates | φ4-inch and φ6-inch wafers |
| Substrate holder | Normal-incidence arrangement (incidence angle 5° or less at φ6 inch) |
| Main applications | Forming electrode films and protective oxide films by lift-off |
Specifications as published by the maker. See the sources below.
Overview
SEC-22C is Showa Shinku's vacuum evaporation system. It can deposit electrode films and oxide films and is configured for lift-off processes so that evaporated material reaches the wafer perpendicularly. It handles φ4-inch and φ6-inch wafers.
It offers fast pumping that reaches 4.0×10⁻⁴ Pa in 20 minutes, thickness uniformity of ±1.0% or less across a φ4-inch wafer, and normal-incidence performance with an incidence angle of 5 degrees or less at φ6 inch with a T/S of 1,100 mm. 4 correction plates adjust the thickness distribution of 4 materials, and Al evaporation is 3 times faster than before.
An optional ion source supports substrate cleaning and assisted deposition. The pumping system consists of a cryopump, a dry pump and a mechanical booster pump, and installation dimensions are W2,500 × D4,300 × H2,800 mm. Applications are electrode film formation for electronic components, lift-off processes and oxide film formation for protective films.
Key features
- Normal incidence for lift-off (incidence angle 5° or less at φ6 inch)
- Thickness uniformity of ±1.0% or less (across φ4 inch)
- Fast pumping to 4.0×10⁻⁴ Pa in 20 minutes
- Al evaporation 3 times faster, ion source (optional)
Applications
- Electrode film formation by lift-off
- Oxide film formation for protective films
Other vacuum evaporation equipment
- ei-5 · ULVAC
- ei-5 / EVD-600LP · ULVAC
Sources
Vacuum evaporation equipment
Last updated: October 23, 2026