ei-5

Specifications

Specifications as published by the maker. See the sources below.

Overview

ei-5 is ULVAC's batch vacuum evaporation system. Evaporation sources can be chosen from electron beam (EB), resistance heating, or EB plus resistance heating, and it handles wafers 50 to 200 mm in diameter and rectangular substrates. Substrate materials include Si, compound semiconductors, glass and ceramic.

Substrate holders can be chosen from orbital, planetary and satellite types; the source-to-substrate distance is 680 mm, and the standard pumping system uses a 16-inch cryopump. Pumping through deposition is automatic, with PC-based recipe functions, data logging and maintenance assistance.

Its sister tool EVD-600LP is designed for lift-off processes and holds more substrates. Applications include electrode formation for power devices, LEDs and LDs and high-speed devices, as well as experiments and electronic components in general.

Key features

• EB, resistance heating or EB + resistance evaporation sources
• Φ50 to 200 mm and rectangular substrates (Si, compound, glass, ceramic)
• Orbital, planetary and satellite substrate holders
• Automatic pumping and deposition, recipes and data logging

Applications

• Electrode formation for power devices, LEDs and LDs
• Metal films for high-speed devices and electronic components

Other vacuum evaporation equipment

• SEC-22C · Showa Shinku
• ei-5 / EVD-600LP · ULVAC

All vacuum evaporation equipment and Japanese suppliers

More from ULVAC

• CC-200 · PECVD equipment
• CCMT-D series · Vacuum gauges
• CME · PECVD equipment
• CME-200E · CVD equipment
• CS · Sputtering equipment
• ENTRON-EX W300 · PVD equipment
• ENTRON-EXX · PVD equipment
• H83 / H84 · Diffusion furnaces

Sources

1. ULVAC: ei-5 / EVD-600LP product page

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