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Transistor density (MTr/mm²) calculator

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KEY POINTS

Logic transistor density is often measured with a metric built from two cells, NAND2 and a scan flip-flop: 0.6 × (4 / NAND2 area) + 0.4 × (36 / SFF area). Density scales roughly inversely with CPP × metal pitch, and Intel 10nm dimensions (CPP 54 nm, MMP 36 nm) give about 100 MTr/mm². Comparing this density, not node names, is the fair comparison.

Transistor density from cell dimensions

Transistor density104.3MTr/mm²
Cell height270nm
NAND2 cell area43.7×10⁻³ µm²
Scan flip-flop cell area0.2916µm²
CPP × MMP (area scaling metric)1944nm²
Transistors on 100 mm²1.04×10¹⁰

The defaults are close to Intel 10nm's published dimensions (CPP 54 nm, MMP 36 nm, cell height about 272 nm) and give a result close to its published density of 100.8 MTr/mm². The average density of a real chip is much lower because it includes SRAM, analog, routing and unused area.

Extrapolating with Moore's law

Density in 2036 (extrapolated)1,670MTr/mm²
Multiple16×
10²10³10⁴2,0262,0282,0302,0322,0342,036YearDensity [MTr/mm²]

Logic density of major processes

Values for high-density cell libraries. High-performance cells (more tracks) on the same node have lower density.
ProcessDensity (MTr/mm²)Type of source
Intel 14nm37.5Published by Intel
Intel 10nm (Intel 7)100.8Published by Intel
TSMC N7About 91Estimate from analysis
TSMC N5About 170Estimate from analysis
TSMC N3About 200 to 290Estimate (varies with cell library)

Compare density, not node names

Node names such as "5nm" and "3nm" no longer describe any physical transistor dimension, so they cannot be compared across companies by the number alone. The metric proposed instead counts transistors per mm² from the areas of two representative cells, a NAND2 and a scan flip-flop. Density scales roughly inversely with CPP × MMP and also rises when the number of tracks in the cell height is reduced.

Shrinking CPP and MMP is approaching physical limits and density gains have slowed. The industry has entered a phase of structural design-technology co-optimization (DTCO): fewer fins to lower cell height, GAA nanosheets to cut tracks, backside power delivery to free front-side routing and CFETs that stack nMOS and pMOS vertically.

FAQ


Why don't node names match feature sizes?

Node names no longer describe any physical transistor dimension and differ between companies, so density is used for comparison instead.

Why is real chip density lower?

Chips also contain SRAM, analog blocks, routing and unused space, so the average density is well below the logic cell density.

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Last updated: October 23, 2026