DB820
A die bonder for paste processes for logic and analog products. It handles small dies and dense, compact packages.
Maker: Fasford Technology · Official product page
Specifications
| Bonding method | Paste (also supports DAF) |
|---|---|
| Series | Single model (handles dies down to □0.3 mm) |
| Key feature | Small die bonding, high-resolution optical inspection |
| Main applications | Logic and analog (ASIC) products |
Specifications as published by the maker. See the sources below.
Overview
DB820 is Fasford Technology's die bonder. It was developed based on the company's DB830plus+ series and mainly targets paste processes.
It supports production of logic products such as ASICs and analog products, and can also be used for production with DAF (die attach film) processes. In addition to the high quality and stability carried over from DB830plus+, it focuses on easier operation, with less manual work and more consistent results.
It has technology for stably handling dies as small as 0.3 mm square and high-precision paste inspection with high-resolution optics. It suits packages that are becoming smaller, denser and more stacked.
Key features
- For paste processes (also supports DAF)
- Stable handling of small dies down to 0.3 mm square
- Paste inspection with high-resolution optics
- Easier operation with less manual work and more consistency
Applications
- Die bonding of logic products such as ASICs and analog products
Other die bonders
- DB830plus+ series · Fasford Technology
Sources
Last updated: October 23, 2026