DB830plus+ series
A high-precision die bonder with a 2-in-1 concept that supports both stacked packages using DAF processes and general-purpose products using paste processes. It can switch between direct mode and parallel mode.
Maker: Fasford Technology · Official product page
Specifications
| Bonding method | DAF and paste (2-in-1) |
|---|---|
| Series | DB830plus+D / DB830plus+ / DB830plusH / DB830plusS |
| Key feature | Intermediate stage, thin die bonding, multi-level stacking |
| Main applications | Stacked memory packages and general-purpose packages |
Specifications as published by the maker. See the sources below.
Overview
The DB830plus+ series are Fasford Technology's die bonders. A die bonder attaches and mounts chips singulated by dicing onto lead frames or substrates.
It uses a 2-in-1 concept that handles both stacked packages using DAF (die attach film) processes and general-purpose products using paste processes in one tool. It can switch between direct mode and parallel mode and supports multi-level stacking.
Bonding positioning accuracy has been improved, and it carries a vision system with position correction. Multi-stage pickup allows thin dies to be picked up. The series includes DB830plus+D, DB830plus+, DB830plusH and DB830plusS, and Fasford also offers the DB820 for paste processes.
Key features
- 2-in-1 concept supporting both DAF and paste processes
- Switching between direct and parallel modes, multi-level stacking
- Vision system with position correction
- Thin die support with multi-stage pickup
Applications
- Stacked packages such as memory (DAF process)
- Paste die bonding for general-purpose products
Other die bonders
- DB820 · Fasford Technology
Sources
Last updated: October 23, 2026