i-THOP® (substrate for 2.3D packages)
A substrate with an integrated organic interposer, made by forming thin-film fine wiring layers on a build-up substrate. It was developed as an alternative to 2.5D packages.
Specifications
| Interposer material | Organic (thin-film wiring layers on a build-up substrate) |
|---|---|
| Wiring rules | L/S 2 µm / 2 µm, via diameter 10 µm |
| Structure | Interposer and substrate integrated |
| Main applications | Chip partitioning, heterogeneous chip connection, high-bandwidth memory connection, CPO |
Specifications as published by the maker. See the sources below.
Overview
i-THOP (integrated Thin film High density Organic Package) is Shinko Electric's substrate for 2.3D packages. It combines an organic interposer and a build-up substrate into one high-density wiring substrate.
Thin-film technology in the interposer section forms narrow-pitch wiring and many I/O terminals. It supports chip-last processes and can be manufactured at panel level.
As an alternative to 2.5D structures that use silicon interposers, it targets large packages for mounting heterogeneous chips, mounting high-bandwidth memory (HBM) and integrating chiplets. It is being developed for high-performance CPUs and GPUs.
Key features
- Organic interposer and build-up substrate integrated
- Narrow-pitch wiring with thin-film technology
- Panel-level manufacturing, supports chip-last
- Product under development
Applications
- High-performance CPUs and GPUs
- HBM mounting and chiplet integration
More from Shinko Electric Industries
- DLL® / DLL3® (flip-chip package substrates) · Package substrates (FC-BGA)
- QFN/QFP and TSOP lead frames · Lead frames
Sources
Last updated: October 23, 2026