Synapse™ V / Synapse™ Z Plus

Specifications

Specifications as published by the maker. See the sources below.

Overview

Synapse V and Synapse Z Plus are bonding and debonding systems for 300 mm wafers from Tokyo Electron (TEL). They efficiently perform temporary bonding and debonding of wafers in 3D packaging processes that use TSVs.

Synapse V coats, dries and bonds the material used to temporarily bond 2 wafers, running the whole process for a variety of adhesive materials in one tool. Its own alignment mechanism and bonding module give industry-leading TTV (thickness variation) and high bonding accuracy. It supports up to 3 adhesive layers.

Synapse Z Plus debonds wafers and cleans both the device wafer and the carrier wafer, handling the complex steps after the TSV process in one tool. It can stably transfer and process very thin wafers of 50 µm or less. It received the 18th Semiconductor of the Year award.

Key features

• Dedicated tools for the full temporary bonding and debonding process
• Adhesive thickness TTV below 5%
• Handles thin wafers of 50 µm or less

Applications

• Temporary bonding and debonding in the TSV process

Also listed under: Temporary bonding and debonding equipment

Other tsv formation equipment

• UFP600AS · Ebara
• BGM300 · Lasertec
• VIANCA series · Lasertec
• ASE-Pegasus · SPP Technologies

All tsv formation equipment and Japanese suppliers

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• ANTARES™ · Dry cleaning equipment
• Cellcia™ · Wafer probers
• CELLESTA™-i · Single-wafer cleaning equipment
• CELLESTA™-i MD · Single-wafer cleaning equipment
• CELLESTA™ MS2 · Wafer scrubbers
• CELLESTA™ Pro SPM · Wet resist strip equipment
• CELLESTA™ SCD · Wafer dryers

Sources

1. TEL: Synapse / Ulucus series product page

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