Underfill dispensing equipment
FAD5100S
Musashi Engineering's fully automatic dispenser for underfill. For wafer-level use there is also FAD5100S-WH with EFEM support.
Maker: Musashi Engineering · Official product page
Specifications
| Dispensing method | Fully automatic dispensing |
|---|---|
| Supported workpieces | Substrates (wafers with FAD5100S-WH) |
| Configuration | Inline fully automatic machine |
| Main applications | Underfill dispensing for flip chips |
Specifications as published by the maker. See the sources below.
Overview
FAD5100S is Musashi Engineering's fully automatic dispenser for underfill. It flows resin (underfill) into the gap between a flip-chip-mounted chip and its substrate.
It offers high dispensing quality and productivity for semiconductor and packaging applications. For wafer-level processing there is FAD5100S-WH, which supports an EFEM (wafer transfer module at the front of the tool).
Key features
- Fully automatic machine for underfill
- FAD5100S-WH for wafers (EFEM support)
Applications
- Underfill dispensing for flip chips
- Wafer-level dispensing
More from Musashi Engineering
- FAD5700 · Dispensers
Sources
Last updated: October 23, 2026