Package substrates (FC-BGA)
DLL® / DLL3® (flip-chip package substrates)
Shinko Electric's flip-chip substrates built up in multiple layers with a semi-additive process and stacked vias. DLL3 is a coreless substrate without a core layer.
Specifications
| Substrate structure | Build-up (DLL) / coreless (DLL3) |
|---|---|
| Interconnect formation | Semi-additive process, stacked vias |
| Main applications | High-performance flip-chip LSIs |
Specifications as published by the maker. See the sources below.
Overview
DLL and DLL3 are Shinko Electric's substrates for flip-chip packages. They form multilayer wiring with a semi-additive process and stacked vias.
DLL3 is a coreless substrate without a core layer, used for high-performance LSIs such as servers, GPUs and CPUs.
Key features
- Semi-additive process + stacked vias
- DLL3 has a coreless structure
Applications
- Servers
- GPUs and CPUs
Other package substrates (fc-bga)
- FC-BGA substrates · IBIDEN
- FC-BGA substrates · Kyocera
- FC-BGA substrates · Toppan
More from Shinko Electric Industries
- i-THOP® (substrate for 2.3D packages) · Interposer assembly equipment
- QFN/QFP and TSOP lead frames · Lead frames
Sources
Package substrates (FC-BGA)
Last updated: October 23, 2026