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Thermal oxide thickness calculator (Deal-Grove model)

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KEY POINTS

Thermal oxide thickness on silicon follows the Deal-Grove model, x² + Ax = B(t + τ). Thin films grow linearly with time (linear law) and thick films with the square root of time (parabolic law). Wet oxidation is 5 to 10 times faster than dry; on a (100) surface at 1000 °C for one hour, dry oxidation gives about 40 nm and wet about 400 nm.

Inputs

Oxide thickness38.5nm
Time to reach 100 nm3.19 h (191 min)
Silicon consumed (thickness × 0.44)16.9nm
Parabolic rate constant B0.01043µm²/h
Linear rate constant B/A0.04486µm/h
A0.2326µm

Coefficients are Deal and Grove's (1965) values for 1 atm and lightly doped substrates. Rates change with heavily doped substrates, chlorine addition (HCl oxidation), high-pressure oxidation and the H₂/O₂ ratio of pyrogenic oxidation, so calibration against measurements on each furnace is assumed.

Thickness by temperature and time

Dry oxidation (O₂), (100) surface, no initial oxide.
Temperature30 min1 h2 h4 h
900 °C5 nm9 nm18 nm35 nm
1000 °C21 nm38 nm69 nm119 nm
1100 °C59 nm99 nm158 nm245 nm
1200 °C116 nm178 nm268 nm395 nm

How the Deal-Grove model works

In thermal oxidation, the oxidant (O₂ or H₂O) diffuses through the oxide already formed, reaches the Si interface and reacts there to grow the film. While the film is thin, the interface reaction limits growth and thickness increases linearly with time (linear law, coefficient B/A). Once it is thick, diffusion through the film limits growth and thickness increases with the square root of time (parabolic law, coefficient B). The Deal-Grove model combines both into a single equation, x² + Ax = B(t + τ).

H₂O is about three orders of magnitude more soluble in SiO₂ than O₂, so wet oxidation grows 5 to 10 times faster than dry oxidation at the same temperature. That is why thick films such as isolation and field oxides use wet oxidation, while gate oxides and thin pad oxides, where film quality matters, use dry oxidation.

FAQ


How much silicon does thermal oxidation consume?

About 0.44 of the oxide thickness. Growing 100 nm of oxide consumes about 44 nm of silicon.

Is the Deal-Grove model accurate for gate oxides?

Not below about 30 nm in dry oxidation. Real growth is faster in that range (initial enhanced oxidation), so the model underestimates thin gate oxides.

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Last updated: October 23, 2026