UPC-12500 (SORA) FOUP/FOSB cleaning system
Hugle Electronics' fully automatic carrier cleaning system for 300 mm.
Maker: Hugle Electronics · Official product page
Specifications
| Target | 300 mm FOUPs and FOSBs |
|---|---|
| Cleaning method | Fully automatic |
| Main applications | Cleaning wafer containers |
Specifications as published by the maker. See the sources below.
Overview
UPC-12500 (SORA) is Hugle Electronics' fully automatic FOUP/FOSB cleaning system. It cleans FOUPs and FOSBs, the containers that carry wafers, to keep particles and contamination from transferring to the wafers.
It uses ultra-precise cleaning with two-fluid jets. It is a greatly improved version of the previous model, combining high throughput with a compact footprint. FOUP lids are opened and closed fully automatically, preventing cross-contamination.
It has a high-efficiency drying system and energy-saving measures, and installation dimensions are 2,200 (W) × 3,250 (D) × 2,500 (H) mm. It complies with SEMI S2 and S8 and CE standards and connects to online manufacturing systems via GEM300 communication. It carries on the previous model's world-class track record in automatic cleaning of 300 mm FOUPs.
Key features
- Ultra-precise cleaning with two-fluid jets
- Automatic opening and closing of FOUPs prevents cross-contamination
- High-efficiency drying and energy saving
- SEMI S2/S8 and CE, supports GEM300
Applications
- Cleaning 300 mm FOUPs and FOSBs
Other carrier cleaning equipment
- FOC300 series FOSB/FOUP cleaning systems · Shibaura Mechatronics
More from Hugle Electronics
- IRISYS®-SX · Ionizers (static elimination)
Sources
Equipment components and subsystems: more products
Last updated: October 23, 2026