FOC300 series FOSB/FOUP cleaning systems
Shibaura Mechatronics' FOSB/FOUP cleaning systems for 300 mm that use two-fluid nozzles.
Specifications
| Target | 300 mm FOSBs and FOUPs |
|---|---|
| Cleaning method | Two-fluid nozzles |
| Main applications | Cleaning wafer containers |
Specifications as published by the maker. See the sources below.
Overview
The FOC300 series are Shibaura Mechatronics' FOSB/FOUP cleaning systems. From loading to unloading, they fully automatically disassemble pods and doors, clean, dry and reassemble them.
Cleaning uses original two-fluid nozzles, and drying is done in a vacuum chamber with lamp heaters at reduced pressure of 10 Pa or less. Throughput is 30 units per hour depending on the recipe, and they handle containers for 300 mm wafers and comply with the GEM300 standards.
Particle removal is 95% or more and removal of adsorbed gases such as ammonia is 80% or more, which Shibaura describes as more than 5 times better than before. Wastewater particle measurement, gas analysis and humidity inspection, and visual inspection can be added as options, and they comply with international standards such as SEMI and CE.
Key features
- Fully automatic disassembly, cleaning, drying and reassembly
- Two-fluid nozzle cleaning + reduced-pressure drying (10 Pa or less)
- Particle removal of 95% or more, adsorbed gas removal of 80% or more
- 30 units per hour, GEM300 support
Applications
- Cleaning 300 mm FOUPs and FOSBs
Other carrier cleaning equipment
- UPC-12500 (SORA) FOUP/FOSB cleaning system · Hugle Electronics
More from Shibaura Mechatronics
- ARTS® (MC-150 series) · Mask cleaning and drying equipment
Sources
Equipment components and subsystems: more products
Last updated: October 23, 2026