CPM1080
TOWA's molding system that handles increasingly large wafers and panels by compression molding. One tool handles both granular and liquid resins.
Maker: TOWA · Official product page
Specifications
| Molding method | Compression molding |
|---|---|
| Supported workpieces | φ300 mm wafers, 320 × 320 mm panels |
| Supported resins | Granular resin, liquid resin |
| Related models | CPM1080-HP (for HBM, 2.5D/3D and chiplets) / CPM1180 (625 × 620 mm panels, φ450 mm) |
| Main applications | FOWLP, FOPLP |
Specifications as published by the maker. See the sources below.
Overview
The CPM1080 series are TOWA's compression molding systems. They mold encapsulation resin by compressing it in the mold, encapsulating the chips arranged on a wafer or panel all at once.
TOWA describes them as optimal for resin molding of 12-inch (φ300 mm) FOWLP/FIWLP and 320 × 320 mm FOPLP/FIPLP. A pre-cut method reduces release film use by about 25%, and one tool handles both granular and liquid resins.
The derivative CPM1080-HP targets advanced packages such as HBM, 2.5D/3D, chiplets and FOWLP/PLP, supporting thin molding and molded underfill (MUF) filling. The CPM series also includes CPM1180, which uses TOWA's own cavity-down method to handle very large panels up to 625 × 620 mm.
Key features
- Compression molding of φ300 mm wafers and 320 × 320 mm panels
- About 25% less release film with the pre-cut method
- Handles both granular and liquid resins
- Thin molding and MUF filling with CPM1080-HP
Applications
- Resin encapsulation for FOWLP, FIWLP and FOPLP
- HBM, 2.5D/3D and chiplets (CPM1080-HP)
Other molding (encapsulation) equipment
- WCM-330 · Apic Yamada
Sources
Last updated: October 23, 2026