WaferX 310

Specifications

Specifications as published by the maker. See the sources below.

Overview

WaferX 310 is Rigaku's simultaneous wavelength-dispersive X-ray fluorescence spectrometer (WDXRF). It measures film thickness and composition on 300 mm and 200 mm blanket (unpatterned) wafers and is used in high-volume semiconductor fabs. Robotic transfer allows fully automatic operation.

By irradiating the wafer with X-rays and measuring the fluorescent X-rays emitted by each element, it determines film composition and thickness non-destructively. Rigaku's patented diffraction avoidance function gives accurate XRF results, and the AD-Boron channel analyzes boron with high sensitivity. For light element detection it uses a 4 kW sealed Rh X-ray tube with an ultra-thin beryllium window and an oil-free solid-state X-ray generator.

It has a height adjustment mechanism that corrects for variation in wafer thickness and can be configured with up to 20 fixed channels or as a scanning type. FOUP, SMIF and through-the-wall configurations are available, with GEM300-compliant software. It measures BPSG, PSG, metal films, multilayer films, WSix, electrode films, ferroelectric thin films (FRAM), films for next-generation DRAM and more.

Key features

• Simultaneous wavelength-dispersive XRF (up to 20 fixed channels)
• Patented diffraction avoidance, high-sensitivity boron analysis with AD-Boron
• 4 kW sealed Rh X-ray tube
• 300/200 mm, fully automatic, GEM300 support

Applications

• Thickness and composition control of BPSG, PSG, metal and multilayer films
• Evaluation of ferroelectric films and films for next-generation DRAM

More from Rigaku

• Thermo plus EVO2 TG-DTA series · Thermal analysis instruments (TG-DTA/DSC)
• TXRF 3760 · Surface analysis instruments (XPS/SIMS)

Sources

1. Rigaku: WaferX 310 product page

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