Surface analysis instruments (XPS/SIMS)

TXRF 3760

A total reflection X-ray fluorescence spectrometer that measures surface contamination on wafers up to 200 mm. It is used for contamination control in every process, including cleaning, lithography and etching.

Maker: Rigaku · Official product page

Specifications


Analysis techniqueTXRF (total reflection X-ray fluorescence)
Key featureMeasures Na to U, detector needs no liquid nitrogen, zero edge exclusion (optional)
Main applicationsMetal contamination analysis of wafer surfaces

Specifications as published by the maker. See the sources below.

Overview


TXRF 3760 is Rigaku's total reflection X-ray fluorescence (TXRF) spectrometer. It irradiates the wafer surface with X-rays at a very shallow angle so that they are totally reflected, measuring trace metal contamination on the surface non-destructively and quickly. It handles wafers of 200 mm and below and small substrates.

An X-ray system that takes 3 beams from 1 target measures elements from sodium (Na) to uranium (U). Detection limits (E10 atoms/cm²) are 25 for Na and Al, 0.1 for Fe and Ni, and 0.15 for Cu. It has a 9 kW rotating-anode W target X-ray source and uses 3 excitation energies optimized for different groups of elements.

It has an XYθ stage to avoid diffraction, robotic wafer transfer in vacuum and an electronically cooled detector that needs no liquid nitrogen. Sweeping TXRF, which maps contamination over the whole wafer, and ZEE-TXRF, which measures up to the edge, are options. It is used to analyze contamination in each process, including cleaning, lithography, etching, ashing and deposition, and handles Si and non-Si substrates.

Key features


Applications


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More from Rigaku


Sources


  1. Rigaku: TXRF 3760 product page

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Surface analysis instruments (XPS/SIMS)

Last updated: October 23, 2026