CELLESTA™ SCD
A single-wafer cleaning system that adds dedicated supercritical drying chambers to the CELLESTA platform. Drying with a supercritical fluid, which has zero surface tension, prevents fine patterns from collapsing.
Specifications
| Drying method | Supercritical fluid drying |
|---|---|
| Processing unit | Single wafer |
| Key feature | Avoids the pattern collapse seen with low-surface-tension alcohol drying |
| Main applications | Drying after cleaning of advanced devices with finer, more layered structures |
Specifications as published by the maker. See the sources below.
Overview
CELLESTA SCD is a tool that adds dedicated supercritical drying chambers to the platform of TEL's CELLESTA single-wafer cleaning system. Sales began in January 2021.
When wafers are dried after cleaning, conventional alcohol drying can let the surface tension of the liquid pull fine patterns over. CELLESTA SCD dries wafers with a supercritical fluid, whose surface tension is zero, so pattern collapse does not occur.
It was developed to solve the drying problem in the cleaning steps of leading-edge devices that keep getting finer and adding more layers.
Key features
- Drying with a supercritical fluid
- Prevents pattern collapse
- Dedicated chambers on the CELLESTA platform
Applications
- Drying after cleaning of advanced devices
- Drying of high aspect ratio patterns
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Sources
Front-end equipment: more products
Last updated: October 23, 2026