F-REX300X
The standard model of Ebara's F-REX CMP systems. It has a track record on 300 mm lines and supports multi-step polishing from metal films to barrier metals.
Maker: Ebara · Official product page
Specifications
| Wafer size | 300 mm |
|---|---|
| Top rings | 4 |
| Turntables | 4 |
| Cleaning units | 6 |
| Main applications | Polishing of Cu, W and barrier metals |
Specifications as published by the maker. See the sources below.
Overview
F-REX300X is the 300 mm standard model of Ebara's F-REX CMP systems. It is a CMP system installed in the cleanroom, with reliability and process performance proven in the market, and it can be configured in many ways to meet requirements.
Its main feature is the dual-module design. There is no cross-contamination between process chambers, and if one module stops, operation switches automatically to the other, so the whole tool does not need to stop for maintenance or trouble.
Because one tool can handle several processes, it can be configured not only for volume production but also for experiments and development. The successor F-REX300XA carries over this structure and further optimizes transfer and throughput.
Key features
- Dual-module design (operation continues automatically if one side stops)
- Structure with no cross-contamination between process chambers
- Dry-in/dry-out and multi-stage chemical cleaning
- Polishing endpoint monitor and inline film thickness gauge (optional)
Applications
- Metal CMP of Cu, W, barrier metals and others
- Volume production and development lines that handle several processes in one tool
Other metal cmp equipment
- ChaMP211 · Tokyo Seimitsu (ACCRETECH)
More from Ebara
- EV-M series · Vacuum pumps
- F-REX300XA · Oxide CMP equipment
- TND-Single (including TND-Single Plus) · Exhaust gas abatement systems
- UFP600AS · TSV formation equipment
Sources
Front-end equipment: more products
Last updated: October 23, 2026