CELLESTA™ Pro SPM
A model in TEL's CELLESTA single-wafer cleaning series dedicated to SPM (sulfuric acid and hydrogen peroxide mixture) processing.
Specifications
| Processing method | Single-wafer wet (SPM) |
|---|---|
| Wafer size | 300 mm |
| Key feature | CELLESTA platform |
| Main applications | Resist stripping and organic removal |
Specifications as published by the maker. See the sources below.
Overview
CELLESTA Pro SPM is the model in TEL's CELLESTA single-wafer cleaning series dedicated to SPM (sulfuric acid and hydrogen peroxide mixture) processing. Sales began in May 2019.
Dedicated SPM chambers are stacked, with up to 18 chambers per tool. Compared with the previous tool, productivity is 1.5 times higher and SPM chemical cost can be cut by up to 50%, greatly reducing sulfuric acid use.
Technology that suppresses splashing, contamination prevention and automatic cleaning make it maintenance-free. It can also be used for wet metal etching of TiN and W films with controlled selectivity, post-CMP cleaning and post-ash cleaning.
Key features
- Up to 18 dedicated SPM chambers
- 1.5 times the productivity of the previous tool
- Up to 50% lower SPM chemical cost
- Also handles wet metal etching of TiN and W
Applications
- Resist stripping
- Post-CMP and post-ash cleaning
- Cleaning steps in memory and logic
Other wet resist strip equipment
- SU-3400 · SCREEN Holdings
More from Tokyo Electron (TEL)
- ALPHA-8SE™ i · Diffusion furnaces
- ANTARES™ · Dry cleaning equipment
- Cellcia™ · Wafer probers
- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ MS2 · Wafer scrubbers
- CELLESTA™ SCD · Wafer dryers
- Certas LEAGA™ · Dry cleaning equipment
Sources
Front-end equipment: more products
Last updated: October 23, 2026