9000 series
Hitachi High-Tech's 300 mm conductor etching system that can carry up to 9 modular chambers. For the 20 nm generation and beyond.
Maker: Hitachi High-Tech · Official product page
Specifications
| Type | Microwave ECR plasma etching |
|---|---|
| Wafer size | 300 mm |
| System configuration | Up to 9 chambers (linked platform) |
Specifications as published by the maker. See the sources below.
Overview
The 9000 series is Hitachi High-Tech's conductor etching system. Devices at the 20 nm generation and beyond require precise, complex processes such as double patterning, 3D structures, and post-treatment and protective film formation for new materials.
A unified interface allows a variety of precisely modularized chambers to be installed, providing extensible, flexible processes for leading-edge devices. Proven Hitachi microwave ECR etching chambers and others are modularized and can be integrated through a common interface.
A linked platform that can carry up to 9 chambers and Hitachi's own low-particle, high-speed transfer system deliver high productivity.
Key features
- Linked platform with up to 9 chambers
- Microwave ECR chambers
- Modular design with a common interface
- Low-particle, high-speed transfer
Applications
- Conductor etching for the 20 nm generation and beyond
- Processing for double patterning and 3D structures
Other polysilicon etchers
- M-8000 series · Hitachi High-Tech
- Tactras™ · Tokyo Electron (TEL)
More from Hitachi High-Tech
Sources
Front-end equipment: more products
Last updated: October 23, 2026