CELLESTA™ MS2
TEL's cleaning system that performs physical cleaning with two-fluid spray and brushes and processes both sides of the wafer at the same time.
Specifications
| Type | Physical cleaning (two-fluid spray, brush), both sides at once |
|---|---|
| Throughput | 800 wph |
| Key feature | Double-sided productivity per unit area at least 1.5 times that of the previous tool |
Specifications as published by the maker. See the sources below.
Overview
CELLESTA MS2 is a cleaning system for 300 mm wafers from Tokyo Electron (TEL). It performs physical cleaning with two-fluid spray and brushes.
Because it can process the front and back at the same time, productivity per unit area for double-sided processing is at least 1.5 times that of the previous tool (TEL comparison). Pure water and gas once used to protect the side not being cleaned are no longer needed, reducing utility use.
TEL's own wafer holding technology allows cleaning right out to the outermost edge and bevel of the wafer, which had been difficult. Throughput is 800 wph.
Key features
- Two-fluid spray plus brush
- Both sides processed at once
- Cleans out to the outer edge and bevel
- 800 wph
Applications
- Particle removal from both sides of the wafer
Other wafer scrubbers
More from Tokyo Electron (TEL)
- ALPHA-8SE™ i · Diffusion furnaces
- ANTARES™ · Dry cleaning equipment
- Cellcia™ · Wafer probers
- CELLESTA™-i · Single-wafer cleaning equipment
- CELLESTA™-i MD · Single-wafer cleaning equipment
- CELLESTA™ Pro SPM · Wet resist strip equipment
- CELLESTA™ SCD · Wafer dryers
- Certas LEAGA™ · Dry cleaning equipment
Sources
Last updated: October 23, 2026