Certas LEAGA™
Tokyo Electron's gas chemical etch system for 300 mm wafers, which etches and cleans surfaces without liquid chemicals. It uses no plasma and leaves no watermarks.
Specifications
| Wafer size | 300 mm |
|---|---|
| Type | Gas chemical (dry) etching, plasma-less |
| Chamber configuration | Up to 6 chambers (2 wafers processed at once) |
| Main applications | Pre-clean before silicon contacts, oxide removal, selective etching |
Specifications as published by the maker. See the sources below.
Overview
Certas LEAGA is a gas chemical etch system for 300 mm wafers from Tokyo Electron. It etches and cleans surfaces without liquid chemicals, with low environmental impact and high throughput, and is positioned as a core tool for isotropic etching.
Its fully dry process units produce no watermarks, show unique selectivity when etching various oxides, and allow clean control of fine interfaces. Because it uses no plasma, it runs with high uptime at low cost. Combining it with TEL cleaning systems adds flexibility.
It processes 2 wafers at once, can carry up to 6 process chambers, and its process units can be rearranged freely. It is used from volume production to next-generation development for surface cleaning before silicon contacts, removal and etch-back of silicon oxide, selective etching of high-aspect-ratio 3D structures and fine recesses.
Key features
- Fully dry gas chemical etching without liquid chemicals
- Plasma-less for high uptime and low cost
- 2 wafers processed at once, up to 6 chambers
- Unique selectivity for various oxides, no watermarks
Applications
- Surface cleaning before silicon contacts
- Removal and etch-back of silicon oxide
- Selective etching and recessing of 3D structures
Other dry cleaning equipment
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Sources
Dry cleaning equipment
Last updated: October 23, 2026