F-REX300XA
Ebara's CMP system for 300 mm wafers. Compared with the standard F-REX300X, its transfer mechanism and WPH optimization algorithm raise productivity.
Maker: Ebara · Official product page
Specifications
| Wafer size | 300 mm |
|---|---|
| Positioning | Higher model than the standard F-REX300X |
| Key feature | High-efficiency transfer mechanism, WPH optimization algorithm |
| Series | F-REX300XA / F-REX300X / F-REX200M2 (200 mm) |
| Main applications | Planarization of STI and interlayer dielectrics |
Specifications as published by the maker. See the sources below.
Overview
F-REX300XA is Ebara's CMP system for 300 mm wafers. With a newly developed high-efficiency transfer mechanism and a WPH (wafers per hour) optimization algorithm, it raises productivity further over the standard F-REX300X.
It keeps Ebara's highly reliable structure of 1 table and 1 head per unit in a dual-module design. A flexible transfer mechanism with more freedom of movement and stronger cross-contamination measures are said to help improve yield.
A modular structure that is easy to modify and upgrade limits the time needed for future functional additions. Power consumption is about 10% lower than F-REX300X, and fewer parts also reduce CO₂ emissions in the supply chain.
Key features
- High-efficiency transfer mechanism and WPH optimization algorithm raise productivity
- Highly reliable structure with 1 table and 1 head in a dual-module design
- Dry-in/dry-out and multi-stage chemical cleaning
- About 10% lower power consumption than F-REX300X
- Polishing endpoint monitor and inline film thickness gauge (optional)
Applications
- Planarization of STI and interlayer dielectrics
- A range of CMP steps on 300 mm volume lines
Also listed under: STI CMP equipment
FAQ
How does it differ from F-REX300X?
F-REX300XA keeps the structure of F-REX300X but adds a new transfer mechanism and a WPH optimization algorithm to raise productivity. Its power consumption is also about 10% lower than F-REX300X.
Other oxide cmp equipment
- ChaMP332 · Tokyo Seimitsu (ACCRETECH)
More from Ebara
- EV-M series · Vacuum pumps
- F-REX300X · Metal CMP equipment
- TND-Single (including TND-Single Plus) · Exhaust gas abatement systems
- UFP600AS · TSV formation equipment
Sources
Front-end equipment: more products
Last updated: October 23, 2026