Nanoimprint lithography (NIL)

FPA-1200NZ2C

Canon's nanoimprint semiconductor manufacturing system, which presses a mask (mold) engraved with the circuit pattern into resist on the wafer like a stamp to transfer it. Launched in 2023.

Maker: Canon · Official product page

Specifications


TypeNanoimprint (step and repeat)
Minimum line width14 nm (equivalent to the 5 nm node)
Key featureNo optics, low power consumption and low cost
Main applicationsCircuit patterning for advanced logic and memory

Specifications as published by the maker. See the sources below.

Overview


FPA-1200NZ2C is Canon's nanoimprint semiconductor manufacturing system. Instead of printing circuits with light as in projection lithography, it uses nanoimprint lithography (NIL), which presses a mask (mold) engraved with the circuit pattern into the resist on the wafer like a stamp to transfer it.

The minimum line width is 14 nm, supporting logic manufacturing equivalent to the 5 nm node. Because there are no optics in between, even complex 2D and 3D circuit patterns can be formed with one imprint. Because it does not depend on light source wavelength, it greatly reduces power consumption and CO₂ emissions compared with projection lithography and also lowers CoO (cost of ownership).

Newly developed environmental control technology suppresses particle generation and contamination. Specifications include a 26 × 33 mm imprint area, 6-inch masks, 300 mm wafers and overlay accuracy of 4 nm or less. Beyond logic and memory, applications are expanding to fine structures such as metalenses for XR.

Key features


Applications


FAQ


How does nanoimprint differ from EUV lithography?

EUV projects and prints the mask pattern with extreme ultraviolet light. Nanoimprint transfers the pattern by pressing a mold directly into the resist, so it needs no large light source or projection optics and keeps power consumption low.

More from Canon


Sources


  1. Canon: FPA-1200NZ2C product page

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Last updated: October 23, 2026