Mask dimension and flatness metrology

MASK MVM-SEM® E3650

A multi-vision metrology SEM for photomasks in the E3600 series. Measurement throughput is twice that of the previous E3640.

Maker: Advantest · Official product page

Specifications


Measurement methodMask CD-SEM (multi-dimensional observation and measurement)
Target masksAdvanced photomasks, EUV masks, NIL templates
Related modelsE3660 (for 2 nm and beyond, 2025)
Main applicationsMeasuring mask pattern dimensions and contours

Specifications as published by the maker. See the sources below.

Overview


MASK MVM-SEM E3650 is Advantest's CD-SEM (critical dimension measurement system) for photomasks. Its own electron beam scanning technology measures pattern dimensions on photomasks with high accuracy and stability.

It targets photomasks for sub-10 nm node devices, EUV masks and master templates for nanoimprint. It supports CD measurement of fine patterns, optimized MAM (Move Acquire Measure) time, large field-of-view measurement, DBM (Design Based Metrology) using design data, and 3D observation.

Measurement throughput is twice that of the previous E3640, and measurement repeatability and long-term CD stability are also improved. It is designed to handle the larger number of masks and measurement points that come with multi-patterning and scaling, and is the latest model in the widely used E3600 series.

Key features


Applications


Other mask dimension and flatness metrology


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More from Advantest


Sources


  1. Advantest: MASK MVM-SEM E3650 product page

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Mask dimension and flatness metrology

Last updated: October 23, 2026