LS9300AD

Specifications

Specifications as published by the maker. See the sources below.

Overview

LS9300AD is a wafer surface inspection system that Hitachi High-Tech launched on March 14, 2024. It inspects particles and defects on the front and back of unpatterned wafers and is used for quality assurance at wafer shipment and receipt and for particle control in device manufacturing.

As devices shrink and become more complex, the defects and particles that must be controlled are getting smaller, and control now has to include tiny low-profile (low aspect ratio) defects. At the same time, inspection cost has to be kept down as production volumes grow.

In addition to conventional dark-field laser scattering inspection, LS9300AD adds a new DIC (differential interference contrast) inspection function. Because DIC optics turn surface relief on the wafer into high-contrast images, it can detect tiny low-aspect defects that are hard to catch with scattered light. Hitachi says its high-sensitivity, high-throughput double-sided inspection helps lower inspection cost and improve yield.

Key features

• Dark-field laser scattering inspection + DIC inspection
• Detection of tiny low-aspect defects
• High-sensitivity, high-throughput inspection of both front and back

Applications

• Outgoing inspection at wafer makers and incoming inspection at device makers
• Particle control in semiconductor manufacturing

More from Hitachi High-Tech

• 9000 series · Polysilicon etchers
• ArBlade® 5000 · Decapsulation and cross-sectioning equipment
• CG7300 · CD-SEMs
• CR7300 · Review SEMs
• CS5000 · CD-SEMs
• CT1000 · Review SEMs
• CV7300 · CD-SEMs
• DI2800 · Optical wafer inspection equipment

Sources

1. Hitachi news release (March 14, 2024)

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