CT1000
An SEM that tilts wafers of 200 mm and smaller to observe defects and pattern shapes in 3D. EDS can also estimate elements.
Maker: Hitachi High-Tech · Official product page
Specifications
| Resolution | 7 nm (1 kV) |
|---|---|
| Maximum sample tilt | 55° |
| Wafer size | 100 / 150 / 200 mm |
Specifications as published by the maker. See the sources below.
Overview
CT1000 is Hitachi High-Tech's defect shape evaluation SEM. 3D observation of defects and pattern shapes helps shorten development and improve quality for G&C devices (SAW/BAW, MEMS, sensors, power and analog devices made on 100 to 200 mm wafers).
It automatically transfers wafers of 200 mm and smaller, moves accurately to important pattern locations or to defects found by defect inspection systems, and tilts the sample stage for three-dimensional SEM observation.
A 5-axis sample stage allows tilted observation of defects and pattern shapes, and optional elemental analysis (EDS) can estimate the elements that make up particles and defects. Resolution is 7 nm (1 kV), and the maximum sample tilt is 55°.
Key features
- Tilted observation with a 5-axis stage
- Element estimation with EDS (optional)
- Resolution of 7 nm (1 kV)
Applications
- Defect evaluation for SAW/BAW, MEMS and power devices
Other review sems
- CR7300 · Hitachi High-Tech
More from Hitachi High-Tech
- 9000 series · Polysilicon etchers
- ArBlade® 5000 · Decapsulation and cross-sectioning equipment
- CG7300 · CD-SEMs
- CS5000 · CD-SEMs
- CV7300 · CD-SEMs
- DI2800 · Optical wafer inspection equipment
- DI4600 · Wafer inspection equipment
- GT2000 · CD-SEMs
Sources
Front-end equipment: more products
Last updated: October 23, 2026