Adwill RAD-2512F/12
LINTEC's fully automatic wafer mounter. Its own table design mounts wafers without touching the front surface, and it applies pre-cut tape under vacuum even to wafers with uneven backs.
Maker: LINTEC · Official product page
Specifications
| Wafer size | 300 mm |
|---|---|
| Automation | Fully automatic |
| Functions | Vacuum pre-cut tape application, non-contact front-side mounting, non-contact backside transfer |
| Main applications | Dicing tape application for power device and TSV wafers |
Specifications as published by the maker. See the sources below.
Overview
Adwill RAD-2512F/12 is LINTEC's fully automatic vacuum mounter. It handles the step of applying wafers to dicing tape and fixing them to ring frames.
It applies pre-cut tape under vacuum, so it bonds well even to wafers with uneven backs that roller methods cannot attach properly. LINTEC's own table design mounts wafers without touching the front surface, and a transfer method that does not touch the back either handles processed wafers without contamination. It suits wafers processed for power devices or TSVs.
It supports D series UV-curable and G series non-UV dicing tapes. Host communication (SECS-I, HSMS, GEM), a vision system, inline dicing tape pre-cutting and 300 mm wafer support are options.
Key features
- Pre-cut tape application under vacuum
- Non-contact handling of both wafer front and back
- Supports UV-curable (D series) and non-UV (G series) tapes
- SECS/GEM, vision and inline pre-cutting (optional)
Applications
- Mounting power device wafers with uneven backs
- Dicing tape application for TSV wafers
Other wafer mounters
More from LINTEC
- Adwill (dicing tapes and BG tapes) · Dicing and backgrinding tapes
Sources
Wafer mounters
Last updated: October 23, 2026