Wafer mounters
Wafer mounters attach a thinned wafer to dicing tape on a ring frame so that it can be diced and the chips picked up, and often peel off the surface protection tape used during grinding.
What it does
Mounting very thin wafers without breaking them is the main challenge, so mounters are often connected inline to backgrinders, and some apply tape under vacuum.
Products (3)
- DFM2800 · DISCO
A fully automatic multi-function wafer mounter connected inline to a backgrinder to handle ultra-thin Φ300 mm wafers. It mounts wafers on dicing tape and peels off surface protection tape.
- DMM9200 · DISCO
A MUSUBI-compatible wafer mounter that automates everything from frame mounting of ultra-thin wafers of 15 µm or less to peeling off surface protection tape.
- Adwill RAD-2512F/12 · LINTEC
LINTEC's fully automatic wafer mounter. Its own table design mounts wafers without touching the front surface, and it applies pre-cut tape under vacuum even to wafers with uneven backs.
Japanese makers in this category
Other back-end equipment
- Analog test systems (3)
- Backgrinders (9)
- Burn-in systems (3)
- Dicing saws (13)
- Electron microscopes for observation (SEM/TEM) (3)
- Final test equipment (4)
- Laser dicing equipment (9)
- Memory test systems (10)
- Organic analysis instruments (3)
- Surface analysis instruments (XPS/SIMS) (4)
- Test handlers (5)
- Thermal analysis instruments (TG-DTA/DSC) (3)
Sources
Last updated: October 23, 2026