DMM9200
A MUSUBI-compatible wafer mounter that automates everything from frame mounting of ultra-thin wafers of 15 µm or less to peeling off surface protection tape.
Maker: DISCO · Official product page
Specifications
| Wafer size | Φ200 / 300 mm |
|---|---|
| Mounting accuracy | X/Y ±0.5 mm or less, θ ±0.5° or less |
| Effect | 85% shorter tape replacement time (vs. previous model) |
Specifications as published by the maker. See the sources below.
Overview
DMM9200 is DISCO's MUSUBI-compatible wafer mounter and the next generation of DFM2800. It automates everything from mounting wafers thinned to 15 µm or less onto frames to peeling off the surface protection tape.
Stronger in-tool cleaning prevents wafer breakage from trapped particles. An optimized dicing tape supply path shortens tape replacement time by 85% compared with the previous model. Options for automatic tape replacement and tape frame supply reduce downtime further.
It supports MUSUBI, a cluster system that links several tools, and can be connected to a grinder/polisher to process UV irradiation, inspection, mounting and surface protection tape peeling in one sequence.
Key features
- Handles ultra-thin wafers of 15 µm or less
- 85% shorter tape replacement time
- Supports MUSUBI
Applications
- Frame mounting of ultra-thin wafers
Other wafer mounters
- DFM2800 · DISCO
- Adwill RAD-2512F/12 · LINTEC
More from DISCO
Sources
Wafer mounters
Last updated: October 23, 2026