DFM2800
A fully automatic multi-function wafer mounter connected inline to a backgrinder to handle ultra-thin Φ300 mm wafers. It mounts wafers on dicing tape and peels off surface protection tape.
Maker: DISCO · Official product page
Specifications
| Wafer size | 300 mm |
|---|---|
| Automation | Fully automatic (connected inline to DGP8761) |
| Functions | Dicing tape mounting, protection tape peeling, DAF-integrated tape |
| Main applications | Mounting ultra-thin wafers below 25 µm thick |
Specifications as published by the maker. See the sources below.
Overview
DFM2800 is DISCO's fully automatic multi-function wafer mounter. It mounts wafers thinned on the DGP8761 grinder/polisher onto dicing tape and tape frames and peels off the surface protection tape, and it is used connected inline to the backgrinder.
It handles Φ200 mm and Φ300 mm wafers, including ultra-thin wafers below 25 µm. Frame mounting accuracy is X/Y ±0.5 mm or less and θ ±0.5° or less, and dicing tape accuracy is X/Y ±1.0 mm or less. For next-generation SiP manufacturing, it also supports DAF (die attach film) integrated with dicing tape.
Wafer handling steps are cut to 20% of the previous DFM2700 to lower the risk of breakage, and cleaning mechanisms on each handling pad and table prevent breakage from particles. Maximum throughput in continuous operation is about 50% higher. Combined with DGP8761, recipe selection and operation can be managed centrally from the grinder.
Key features
- Inline operation with DGP8761 (managed centrally from the grinder)
- Φ200/300 mm, ultra-thin wafers below 25 µm
- Handling steps cut to 20% of DFM2700
- About 50% higher maximum throughput, supports DAF-integrated tape
Applications
- Dicing tape mounting and surface protection tape peeling for thinned wafers
- DAF lamination for SiP and stacked memory
Other wafer mounters
- DMM9200 · DISCO
- Adwill RAD-2512F/12 · LINTEC
More from DISCO
Sources
Wafer mounters
Last updated: October 23, 2026