Dicing saws
Dicing saws cut a finished wafer into individual chips with a thin, high-speed rotating blade bonded with diamond abrasive. The wafer is mounted on tape in a frame so the chips stay in place after cutting.
What it does
Dual-spindle saws cut with two blades at once for higher throughput. Dicing saws also cut package substrates, glass, ceramics and other materials used in electronic components.
Products (13)
- DAD3350 · DISCO
A single-spindle automatic dicing saw for workpieces up to Φ8 inch. A 1.8 kW spindle is standard.
- DAD3361 · DISCO
A semi-automatic dicing saw for 300 mm workpieces, with high extensibility.
- DAD3660 · DISCO
A dual-spindle dicing saw for large package substrates up to 360 mm square.
- DAW4110 · DISCO
A water jet saw that makes heat-free curved cuts with pressurized water and abrasive. It was the first water jet saw built for cleanroom use.
- DFD6240 · DISCO
One of the world's smallest single-spindle fully automatic dicing saws. It handles 200 mm wafers with a footprint similar to a manual tool.
- DFD6340 · DISCO
DISCO's standard dual dicing saw for 200 mm wafers, with 30 to 40% higher throughput than the previous model.
- DFD6361 · DISCO
A full-featured 300 mm dicing saw with facing dual spindles.
- DFD6362 · DISCO
A fully automatic dicing saw that raises productivity for Φ300 mm wafers. Shorter spacing between its facing dual spindles speeds up dual cutting.
- DFD6363 · DISCO
DISCO's flagship 300 mm dicing saw with high process extensibility. It supports an automatic blade changer.
- DFD6450 · DISCO
A fully automatic dicing saw with a parallel dual structure in which two spindles sit side by side. It also handles singulation with multiple blades.
- DFD6560 · DISCO
A space-saving 300 mm dicing saw. Five units fit in the space of 4 DFD6362 units.
- DFD6760 · DISCO
DISCO's high-end 300 mm dicing saw that uses two chuck tables to run processing in parallel with transfer and alignment.
- AD3000T-PLUS · Tokyo Seimitsu (ACCRETECH)
A dicing machine from Tokyo Seimitsu (ACCRETECH). It supports ABES, which detects hub blade life and replaces blades automatically, limiting downtime.
Japanese makers in this category
- DISCO · 12 product(s) listed
- Tokyo Seimitsu (ACCRETECH) · 1 product(s) listed
Other back-end equipment
- Analog test systems (3)
- Backgrinders (9)
- Burn-in systems (3)
- Electron microscopes for observation (SEM/TEM) (3)
- Final test equipment (4)
- Laser dicing equipment (9)
- Memory test systems (10)
- Organic analysis instruments (3)
- Surface analysis instruments (XPS/SIMS) (4)
- Test handlers (5)
- Thermal analysis instruments (TG-DTA/DSC) (3)
- TSV formation equipment (4)
Sources
- DISCO: DAD3350 product page
- DISCO: DAD3361 product page
- DISCO: DAD3660 product page
- DISCO: DAW4110 product page
- DISCO: DFD6240 product page
- DISCO: DFD6340 product page
- DISCO: DFD6361 product page
- DISCO: DFD6362 product page
- DISCO: DFD6363 product page
- DISCO: DFD6450 product page
- DISCO: DFD6560 product page
- DISCO: DFD6760 product page
- ACCRETECH: AD3000T-PLUS product page
Related calculators
Japanese equipment by category
Last updated: October 23, 2026