DFD6240
One of the world's smallest single-spindle fully automatic dicing saws. It handles 200 mm wafers with a footprint similar to a manual tool.
Maker: DISCO · Official product page
Specifications
| Type | Fully automatic, single spindle |
|---|---|
| Wafer size | Φ200 mm |
| Spindle | 1.2 kW standard (1.8 kW and 2.2 kW optional) |
Specifications as published by the maker. See the sources below.
Overview
DFD6240 is DISCO's single-spindle fully automatic dicing saw, one of the smallest of its class in the world. It handles 200 mm wafers.
An optimized frame structure and transfer layout give a fully automatic tool the footprint of a manual tool (DISCO's DAD3350), about 20% smaller than DISCO's DFD641. Power and air consumption are also lower.
A newly developed synchro spindle with higher radial stiffness stabilizes processing quality, and a flow controller for cutting water is standard. A rigid 1.2 kW spindle is standard, and choosing a 1.8 kW or 2.2 kW spindle allows heavy-load processing of glass, ceramics and similar materials.
Key features
- One of the world's smallest fully automatic tools of its class
- Synchro spindle
- Cutting water flow controller as standard
- 1.2 to 2.2 kW spindles
Applications
- Dicing of 200 mm wafers
- Cutting glass and ceramics
Other dicing saws
More from DISCO
Sources
Last updated: October 23, 2026