PHI nanoTOF 3+
A time-of-flight secondary ion mass spectrometer (TOF-SIMS) that brings in fully automatic analysis technology developed for XPS. It automates everything from sample transfer to measurement.
Maker: ULVAC-PHI · Official product page
Specifications
| Analysis technique | TOF-SIMS (time-of-flight secondary ion mass spectrometry) |
|---|---|
| Analysis targets | Organic and inorganic surface contamination (small areas) |
| Key feature | Spatial resolution 50 nm (high spatial resolution mode), fully automatic analysis |
| Main applications | Surface contamination and composition analysis of semiconductors and battery materials |
Specifications as published by the maker. See the sources below.
Overview
PHI nanoTOF 3+ is ULVAC-PHI's time-of-flight secondary ion mass spectrometer (TOF-SIMS). It measures the mass of secondary ions ejected when an ion beam hits the sample surface, obtaining highly sensitive information on surface elements and molecules. It is used to analyze surface contamination and tiny particles on semiconductors.
A triple-focusing TRIFT electrostatic analyzer achieves high mass resolution and high detection sensitivity at the same time. Spatial resolution is 50 nm in high spatial resolution mode. Tandem mass spectrometry (MS/MS) is available as an option for analyzing molecular structure.
Patented charge neutralization, which uses pulsed low-energy electrons and argon ions together, allows analysis of insulators without sample-by-sample adjustment. It carries over the automatic sample transfer mechanism proven on XPS instruments, allowing unattended spectrum measurement and depth profiling of several insulating samples. One ion gun can also handle everything from cross-section preparation with a FIB function to TOF analysis.
Key features
- TRIFT analyzer combines high mass resolution with high sensitivity
- Spatial resolution of 50 nm (high spatial resolution mode)
- Automatic charge neutralization with pulsed electrons + argon ions
- Unattended measurement with automatic sample transfer, FIB cross-sectioning
Applications
- Contamination analysis of wafer surfaces
- Surface analysis and depth profiling of tiny particles and insulators
Other contamination analysis equipment
- ICPMS-2050 · Shimadzu
More from ULVAC-PHI
- PHI GENESIS · Surface analysis instruments (XPS/SIMS)
Sources
Front-end equipment: more products
Last updated: October 23, 2026