Package substrates (FC-BGA)

What it does

As chips get larger and add chiplets and HBM, substrates are growing in size and layer count, and organic interposer layers are being developed as an alternative to silicon interposers.

Products (4)

• FC-BGA substrates · IBIDEN

  Ibiden's IC package substrates for flip chips, combining fine wiring by SAP with small-diameter microvias made by laser drilling and plating.

• FC-BGA substrates · Kyocera

  Kyocera's build-up organic packages for high-end flip-chip LSIs with more than 9,000 I/O pins.

• DLL® / DLL3® (flip-chip package substrates) · Shinko Electric Industries

  Shinko Electric's flip-chip substrates built up in multiple layers with a semi-additive process and stacked vias. DLL3 is a coreless substrate without a core layer.

• FC-BGA substrates · Toppan

  TOPPAN's package substrates for flip-chip BGAs.

Japanese makers in this category

• IBIDEN · 1 product(s) listed
• Kyocera · 1 product(s) listed
• Shinko Electric Industries · 1 product(s) listed
• Toppan · 1 product(s) listed

Other materials

• Dicing and backgrinding tapes (3)
• Lead frames (3)

Sources

1. Ibiden: product page
2. Kyocera: organic package product page
3. Shinko Electric: DLL product page
4. TOPPAN: FC-BGA product page

Related calculators

• Chip cost calculator (wafer price ÷ good dies)

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