Back-end equipment

Thermal analysis instruments (TG-DTA/DSC)

Thermal analysis instruments measure how materials change with temperature. Thermogravimetry (TG) tracks weight loss, and differential thermal analysis (DTA) and differential scanning calorimetry (DSC) track heat flow, revealing decomposition, melting, glass transition and curing.

What it does


In semiconductors they are used to evaluate encapsulation resins, adhesives, substrates and other packaging materials.

Products (3)


Japanese makers in this category


Other back-end equipment


Sources


  1. Hitachi High-Tech: NEXTA STA product page
  2. Rigaku: TG-DTA (separate controller type) product page
  3. Shimadzu: DSC-60 Plus series product page

Related calculators


More on this topic


Japanese equipment by category

Thermal analysis instruments (TG-DTA/DSC)

Last updated: October 23, 2026